DE Technisches datenblatt 10650050 Easy-Mix S 50cnco_de_tds_10650050_easy-mix_s_50.pdf
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2-component epoxy resin adhesive
50 ml double cartridge, yellowish, clear Weicon Easy-Mix S 50 fast curingItem-no.: 1123224Supplier number: 10005230EAN: 4024596000059
PU (Packaging): 6 STKQuantity:
1 STKPackable
Description
The epoxy resin adhesive WEICON Easy-Mix S 50 is suitable for quick repairs and maintenance works and is ideal for industrial series production with short cycle times. It can be used on numerous materials such as metal, plastic, fibre-reinforced materials, ceramics, glass, stone and wood. Easy-Mix S 50 can be used in many industrial areas.
Attributes
Aluminium sandblasted
19 N/mm²
Base
Epoxy resin, unfilled
Bending strength |DIN EN ISO 178
58.0 MPa
Compressive strength|DIN EN ISO 604
9.0 MPa
Consistency
viscous
Construction material class|DIN 4102
B2
Curing temperature
+6 °C - +40 °C
Density of the mixture
1,15 g/cm³
Dielectric strength|DIN EN 60243-1 (20°C)
20 kV/mm
E-modulus (tensile)|DIN EN ISO 527-2
2.000 - 2.500 MPa
End hardness|(100 % of strength)
24 Hours
Gap bridging up to max.
2 mm
Hardness (Shore D)|DIN ISO 7619
65
Manual strength|(35 % of strength)
30 Min.
Mechanically loadable after|(50 % of strength)
1 Hours
Mixing ratio by weight
1:1
PVC-hard roughened
13.0 N/mm²
Processing temperature
+10 °C to +30 °C °C
Sales bundle
Cartridge
Shrinkage
2 %
Steel 1.0338 sandblasted
20.0 N/mm²
Temperature conductivity
0.133 mm²/s
Temperature resistance
-50 °C to +80 °C
Tensile strength|DIN EN ISO 527-2
40.0 MPa
Tg after curing at RT|(DSC)
44,7 °C
Tg after tempering (90 °C)|(DSC)
46,1 °C
Thermal capacity|DIN EN ISO 22007-4
1.482 J/(g·K)
Thermal conductivity|DIN EN ISO 22007-4
0.24 W/m·K
Through resistance|DIN EN 62631-3-1
1,03·10¹¹ Ω·m
Viscosity of the mixture|at +20 °C
8.500 mPa·s
