DE Technisches datenblatt 12500130 Contact GEL 001cnco_de_tds_12500130_contact_gel_001.pdf
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Item available in 2 variants:
Description
WEICON Contact GEL is pasty (highly thixotropic 60000 - 90000 mPa•s) and cures very slowly. By using WEICON Activator Spray, the curing time can be reduced. The adhesive is suitable for porous surfaces and higher tolerance gaps and can be used on vertical surfaces. Repositioning is also possible after the parts have been joined. It is suitable for the bonding of various materials. WEICON Contact Gel can be used both in the hobby sector and in model building. It can also be used in many different industrial applications.
Attributes
Aluminium sandblasted
5-15 MPa
Base
Ethyl
Coefficient of thermal expansion
~ 80 x 10^-6 m/(m·K)
Colour after curing
colourless
Consistency
pasty
Construction material class|DIN 4102
B2
Density|(+20 °C)
1,1 g/cm³
Dielectric strength|DIN EN 60455-3-8
~ 25 kV/mm
End hardness|(100 % of strength)
24 Hours
Gap bridging up to max.
0,2 mm
On rigid PVC untreated
30-50 Seconds
PC (polycarbonate)
6-12 MPa
Processing temperature
+15 °C to +40 °C °C
Relative humidity
40% - 70%
Sales bundle
Tube
Sandblasted on aluminium
20-30 Seconds
Silicone-free
ja
Steel 1.0338 sandblasted
21.0
Steel sandblasted | Substrate thickness 1.5 mm
11-21 MPa
Temperature resistance
-50°C to +80°C short term up to +100°C
Thermal conductivity|DIN EN ISO 22007-4
0.1 W/m·K
Through resistance|DIN IEC93
>10^15 Ω·cm
Viscosity|25 °C cone / plate
60.000 - 90.000 mPa·s